MULTICHIP MODULE

A module capable of supporting several ICs in a single package. Typically, multichip modules are based on ceramic, contain high performance ICs with high pin count, and use some form of advanced interconnect technology such as TAB, COB , or C-4. The parameters used to define a multichip module are vague, but one basic criterion is a package that is no less that 20% silicon, has no fewer that 100 I/O on a substrate, and has no fewer that four layers.