A component type developed by IBM® consisting of a small substrate with flip chips attached using the DCA process. This small substrate, or module, is now a component with solder pads on the bottom side that can be mounted to a board using conventional surface mount processes.
DIRECT CHIP ATTACH MODULE (DCAM)
Meaning of DIRECT CHIP ATTACH MODULE (DCAM) in English
Electronics Terminology English vocabulary. Английский словарь терминологий электроники. 2012